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Today, at the IEEE IITC conference, nano-electronics research center imec and Tokyo Electron Limited (TEL) presented a direct Cu etch scheme for patterning Cu interconnects. The new scheme has great potential to overcome resistivity and reliability issues that occur while scaling conventional Cu damascene interconnects for advanced nodes.
At this week’s VLSI 2015 Symposium in Kyoto (Japan), imec reported new results on nanowire FETs and quantum-well FinFETs towards post-FinFET multi-gate device solutions.
Newtec, a specialist in designing, developing and manufacturing equipment and technologies for satellite communications, was yesterday presented with the World Teleport Association (WTA) ‘Teleport Technology of the Year’ award for its Newtec Dialog®multiservice platform with Mx-DMA™ technology.
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