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For the first time since that start of the Space Activities in OIP Sensor Systems, hardware fully developed by OIP will set ‘foot’ on a non-terrestrial surface, i.e. the surface of Mars! So far, approximately 10 ton of terrestrial hardware is ‘resting’ on Mars. From October 2016 onwards 600kg will be added by the Schiaparelli, Exomars’ Entry, Descent & Landing Demonstration Module, from which 616g were prepared in the OIP cleanrooms.
Today, at SEMICON WEST 2015 (San Francisco), world-leading nano-electronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The solution features high accuracy and high throughput, paving the way to a manufacturable 2.5D, 3D, and 2.5D/3D hybrid technology.
Spacewalk to install the Antwerp Space ARGO modem onto The[...]
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