Hereby the presentations + conclusions of our Seminar ‘Space 4.0 in Flanders’ on 21 september:SABCA-PPT-VRI-200920181
A major Contract with ESA ranks SPACEBEL among the Key[...]
Today, at SEMICON WEST 2015 (San Francisco), world-leading nano-electronics research center imec and Besi, a global equipment supplier for the semiconductor and electronics industries announced that they have jointly developed an automated thermocompression solution for narrow-pitch die-to-wafer bonding, a method by which singulated dies are stacked onto bottom dies which are still part of a fully intact 300mm wafer. The solution features high accuracy and high throughput, paving the way to a manufacturable 2.5D, 3D, and 2.5D/3D hybrid technology.
Watch iT Grow! The name says it all. Harvest, production, …. Watch it grow and, even more important, monitor your potato fields. A research project that started in 2014 turned into an innovative platform, ready to support the potato sector to sustainably increase the potato production. The new platform is officially announced by all the project partners at the international trade fair Interpom-Primeurs.
Sorry, there are no upcoming events at this moment.
© 2023 VRI